High performance and low power consumption give Winbond's 1Gb LPDDR3 DRAM the edge in Tsing Micro's new AI image-processing SoC

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Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved another great success in high bandwidth memory with Tsing Micro latest artificial intelligence (AI) system-on-chip (SoC).

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Winbond's W25X and W25Q SpiFlash ® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512K-bit to 512M-bit, small erasable sectors and the industry's highest performance. The W25X family supports Dual-SPI effectively doubling standard SPI clock rates. Winbond and Kneron will work on developing microcontroller unit (MCU)-based AI and memory computing. Hong Kong businessman Li Ka-Shing’s venture capital firm Horizons Ventures was the lead investor in the previous $40mn round and has invested in earlier rounds.

Beijing, China-based Tsing Micro's TX510 SoC is a highly advanced AI edge computing engine optimized for functions such as 3D sensing, face recognition, object recognition and gesture recognition. Paired with Winbond's LPDDR3 DRAM, which offers maximum bandwidth of 1866Mb/s and operates from a dual 1.2V/1.8V supply with power-saving features such as Deep Power-Down mode and a Clock Stop capability, the TX510 offers outstanding speed and accuracy in AI imaging applications.

Tsing Micro (www.tsingmicro.com) has implemented an innovative architecture in the TX510 SoC: it includes a 32-bit RISC processor, a reconfigurable neural network engine, a reconfigurable general computing engine, an image signal processor and a 3D sensing engine. For shipping to customers, the TX510 is combined with Winbond's 1Gb LPDDR3 DRAM die in a single 14mm x 14mm TFBGA System-in-Package (SiP).

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Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. Download drivers for Winbond CIR Transceiver. Drivers found: 2. To download the drivers, select the appropriate version of driver and supported operating system.

Achieving computing throughput of up to 1.2 TOPS (tera operations per second), this SiP can perform accurate face recognition (false acceptance ratio of 1 in 10 million) in less than 100ms, and compare features with a library of 100,000 faces in less than 50ms. Peak operating power consumption is just 450mW, and the chip uses just 0.01mW in quiescent mode.

The TX510 is intended for use in applications which require high-speed image detection and recognition, including biometric sensing, video surveillance, smart retail operations, smart home automation and advanced industrial automation.

Wang Bo, CEO of Tsing Micro, said, 'Evaluation of the Winbond LPDDR3 DRAM shows that it is highly competitive both in terms of speed and power consumption. But equally important to us when developing the TX510 was the support and expertise that Winbond provided to us in integrating the DRAM die into a SiP in such a way that it maintained high performance and high signal integrity while taking care of thermal management.'

'Winbond is fast gaining a reputation for providing excellent support to chip and SoC manufacturers which are developing leading-edge AI products. With Winbond low-power DRAM inside, AI products such as the TX510 can set new benchmarks for high performance and throughput while operating from a limited battery power supply,' said Winbond.

Winbond's LPDDR3 DRAM is in mass production. More information can be found at www.winbond.com.

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Tsing Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP

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